
denonjapan
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Feb 10, 2008, 2:26 AM
Post #4 of 4
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Re: [minneapolist] No help so far? No DLP experts?
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Yessssssssss, we're talking an array of micro mirrors. This occurs upon removal of the sacrificial layer. During the preliminary wafer sawing step, it is important that individual chips not be contaminated with particles, which can interfere with the DMD's mechanical operation and can produce defects associated with light scattering. Once the DMD mirrors are mechanically released, The entire assembly process requires a cleanroom environment and particle monitoring. Dissoldering is a VERY IMPORTANT FACTOR, since the package not only provides signal and power lead connections to the chip, but also provides protection from the outside environment.Although a familiar sequence of assembly operations is employed for the DMD—die attach, wire bond, window seal, and final test—the structure nevertheless requires special handling. Front-side, pick-and-place contact collets will damage the DMD's mirror array,and particulate contamination can cause numerous problems. Special attention must be given to particle control and device handling during each re- assembly operation. The die attach and window sealing processes must utilize adhesives with low outgassing properties, since adhesive outgassing can promote mirror stiction. Lastly, regardless of how You take the quality of my advice, will depends the pertinence how you understood your own question. if so,You will then prove me if that's TRUE OR FALSE. denonjapan made in japan
(This post was edited by denonjapan on Feb 10, 2008, 2:31 AM)
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